TItanium Cald Materials - Trusted Supplier of Refractory Metals & Titanium Solutions https://luminatitan.com Thu, 09 Oct 2025 18:36:23 +0000 en-US hourly 1 https://wordpress.org/?v=6.8.2 https://luminatitan.com/wp-content/uploads/2025/08/cropped-4974715d80f0113f2a68bbc35222d7e7-1754214443-32x32.jpg TItanium Cald Materials - Trusted Supplier of Refractory Metals & Titanium Solutions https://luminatitan.com 32 32 Titanium Clad Copper https://luminatitan.com/product/titanium-clad-copper/ Sun, 20 Jul 2025 13:02:16 +0000 https://luminatitan.com/?post_type=product&p=6485 Premium titanium-clad copper for electrolysis, electroplating and power applications. LuminaTitan supplies plate, sheet and bus-bar clad with Ti (Gr1/Gr2) over high-conductivity copper (C11000/C10200), providing corrosion resistance on the wetted surface with copper’s electrical/thermal conductivity. Manufactured under controlled bonding processes and verified in‑house for bond integrity, conductivity and dimensional stability.

Key Advantages

  • Ti-side corrosion resistance with Cu-side conductivity—ideal for electrochemical cells and bus bars.
  • Reliable bond integrity (shear and bend tested) with low interfacial resistance.
  • Custom Ti thickness and Cu core grades to balance durability and current capacity.
  • Machinable to drawings; edges sealed and corners chamfered to reduce delamination risk.
  • Traceable batches with MTC EN 10204 3.1 and optional test reports.

Primary Applications

  • Electroplating and PCB lines: anode/cathode bus bars, contact heads, racks.
  • Electrowinning/electrorefining cells (copper, nickel, zinc): corrosion‑resistant current carriers.
  • Chlor‑alkali and chemical processing equipment: wetted conductive parts.
  • Power distribution in corrosive environments: terminals and connectors.

Testing (typical)

  • Ultrasonic testing across plate area; edge dye‑penetrant (Ti side).
  • Shear / peel strength of Ti‑Cu interface; guided bend checks.
  • Electrical resistivity / IACS conductivity (Cu core).
  • Dimensional: thickness (Ti layer & total), flatness, straightness.

Packaging & Delivery

  • VCI wrap and edge protection → export plywood cases; Ti face protected.
  • Labels include structure (Ti/Cu), grades, sizes, Ti‑thickness, lot/heat, PO; test docs enclosed.
  • Global courier or sea freight; lead times aligned with your schedule.

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]]> Titanium Clad Copper combines a corrosion‑resistant titanium surface with a high‑conductivity copper core. We offer explosive‑bonded or roll‑bonded laminates with Ti Gr1 or Gr2 and copper C11000 (ETP) or C10200 (OF). Clad plates and bus bars are finished on the titanium face (pickled/ground) to perform in acidic/chloride media, while the copper side maintains low electrical losses. Parts can be supplied as cut‑to‑size plates or machined to drawing.

Technical Specifications

Parameter Details Why It Works for You
Standard ASTM B898 (titanium‑clad copper); EN 10204 3.1 docs Recognized spec and documentation for qualification.
Structure Titanium layer + Copper core (Ti/Cu laminate) Corrosion resistance + electrical/thermal conductivity.
Ti Grade Gr1 or Gr2 (ASTM B265) Gr1 for maximum corrosion; Gr2 for higher strength.
Cu Grade C11000 (ETP) or C10200 (OF) High conductivity; oxygen‑free option for critical bonding.
Bonding Method Explosive bonding or roll bonding High bond strength with stable interface.
Dimensions Total thickness 2–60 mm; Ti layer 0.5–3.0 mm; width ≤ 2000 mm; length ≤ 6000 mm Sized for bus bars and plates; other sizes on request.
Bond Strength Shear ≥ 130 MPa (typical, per lot test) Secure interface for machining and service loads.
Conductivity ≥ 80–95% IACS (by copper grade/geometry) Low losses for current‑carrying parts.
Surface (Ti/Cu) Ti: pickled/ground; Cu: bare or tinned/silver‑plated (opt.) Ready for service or downstream joining.
Forms Plate/sheet, bus‑bar, cut blanks; parts to drawing Drop‑in components for your line.
Inspection UT map, shear/peel, bend; dimensions; conductivity Verifies bond, integrity and performance.

 

Titanium Grades (chemical limits, wt%)

Grade N C H Fe O Al V Ti
Gr1 0.03 0.08 0.015 0.20 0.18 — — Balance
Gr2 0.03 0.08 0.015 0.30 0.25 — — Balance

 

Ordering Checklist

  • Structure and spec (ASTM B898), bonding method (explosive/roll).
  • Ti grade & thickness (e.g., Gr2, 1.0 mm) + Cu grade (e.g., C11000).
  • Total thickness, width × length (or bar cross‑section) and tolerances.
  • Surface: Ti face finish; Cu side bare/tinned/silver‑plated; edge sealing.
  • Tests/documents: UT map, shear/bend, conductivity, MTC 3.1, RoHS/REACH.
  • Drawing & machining notes (holes, slots, countersinks, chamfers).

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