Ultra-high purity: Hf + Zr > 99.98%, Zr < 1% for semiconductor, nuclear and high-tech applications where contamination is not an option.
Tight dimensional control: Diameter 0.1–5.0 mm, typical tolerance ±0.05 mm, enabling precise process and device design.
Engineered properties: Cold drawn or annealed to balance tensile strength, ductility and formability for your process.
Clean metallic surface: Smooth, bright silver finish supports stable emission, coating, bonding and vacuum performance.
Standards-based: Produced to ASTM B737, simplifying qualification in critical industries.
Semiconductor: CVD, PVD and ALD processes; precursor and target wire for HfO₂ and high-k dielectric thin films.
Industrial: Superalloy production, plasma cutting electrodes and discharge components operating at high temperature.
High-tech manufacturing: Solder, emitters and evaporation/coating sources in advanced vacuum and plasma systems.
Chemical composition verification (Hf/Zr ratio and impurity profile)
Dimensional & tolerance checks (diameter, roundness)
Surface inspection for defects and cleanliness
Mechanical testing (tensile/ductility) as specified
Packaging: Coils or straight lengths in protective wrapping, packed in sturdy seaworthy cartons/wooden cases or custom solutions.
Shipping: Global delivery with coordinated lead times; support for documentation and export requirements.
LuminaTitanium supplies high-purity hafnium wire manufactured to ASTM B737 for semiconductor, industrial and advanced technology applications. Produced via ultra-purification (crystallization, solid-state refining, sublimation) and precise cold drawing/annealing, our hafnium wire offers high density, excellent emission behavior, stable performance at elevated temperatures and tight dimensional control—ideal for CVD/PVD/ALD, plasma systems, superalloys and specialty coating processes.
| Parameter | Details | Why It Works for You |
|---|---|---|
| Purity | Hf + Zr > 99.98%, Zr < 1% | Ensures consistency in high-purity and nuclear/semiconductor environments |
| Standard | ASTM B737 | Recognized framework for critical hafnium products |
| Size range | Dia 0.1–5.0 mm, tol. ±0.05 mm | Covers fine to medium diameters for thin-film, plasma and alloy uses |
| Condition | Cold drawn, annealed | Choose strength vs. workability for winding, machining or forming |
| Form | Coils or custom forms | Fits automated lines or special assemblies |
| Surface | Bright silver metal | Clean, smooth surface for emission, coating and joining |
| Packing | Seaworthy or custom | Protects wire geometry and cleanliness in global transit |
Standard & purity: ASTM B737; confirm required Hf/Zr ratio & impurity limits.
Diameter & form: 0.1–5.0 mm; coil vs. straight; tolerance and spool/pack format.
Condition: cold drawn or annealed depending on handling and forming needs.
Surface & cleanliness: bright metallic; any additional cleaning/packaging for vacuum or cleanroom use.
Testing & documentation: chemistry, mechanical, dimensional reports; MTC EN 10204 3.1; third-party certificates if needed.
Quantity & packaging: coil lengths, batch sizes, export packing and labeling/traceability.
End use: semiconductor, plasma, superalloy, R&D, etc., to align specs and QA scope.
