Ultra-high purity: Hf + Zr > 99.98%, Zr < 1% for semiconductor, nuclear and high-tech applications where contamination is not an option.
Tight dimensional control: Diameter 0.1–5.0 mm, typical tolerance ±0.05 mm, enabling precise process and device design.
Engineered properties: Cold drawn or annealed to balance tensile strength, ductility and formability for your process.
Clean metallic surface: Smooth, bright silver finish supports stable emission, coating, bonding and vacuum performance.
Standards-based: Produced to ASTM B737, simplifying qualification in critical industries.
Semiconductor: CVD, PVD and ALD processes; precursor and target wire for HfO₂ and high-k dielectric thin films.
Industrial: Superalloy production, plasma cutting electrodes and discharge components operating at high temperature.
High-tech manufacturing: Solder, emitters and evaporation/coating sources in advanced vacuum and plasma systems.
Chemical composition verification (Hf/Zr ratio and impurity profile)
Dimensional & tolerance checks (diameter, roundness)
Surface inspection for defects and cleanliness
Mechanical testing (tensile/ductility) as specified
Send your specifications (grade, size, quantity) — quotation and lead time within 12 hours. Trial orders with flexible MOQ are supported for evaluation and qualification. All materials are supplied with EN 10204 3.1 MTC and full inspection documentation for export compliance.
LuminaTitanium supplies high-purity hafnium wire manufactured to ASTM B737 for semiconductor, industrial and advanced technology applications. Produced via ultra-purification (crystallization, solid-state refining, sublimation) and precise cold drawing/annealing, our hafnium wire offers high density, excellent emission behavior, stable performance at elevated temperatures and tight dimensional control—ideal for CVD/PVD/ALD, plasma systems, superalloys and specialty coating processes.
| Parameter | Details | Why It Works for You |
|---|---|---|
| Purity | Hf + Zr > 99.98%, Zr < 1% | Ensures consistency in high-purity and nuclear/semiconductor environments |
| Standard | ASTM B737 | Recognized framework for critical hafnium products |
| Size range | Dia 0.1–5.0 mm, tol. ±0.05 mm | Covers fine to medium diameters for thin-film, plasma and alloy uses |
| Condition | Cold drawn, annealed | Choose strength vs. workability for winding, machining or forming |
| Form | Coils or custom forms | Fits automated lines or special assemblies |
| Surface | Bright silver metal | Clean, smooth surface for emission, coating and joining |
| Packing | Seaworthy or custom | Protects wire geometry and cleanliness in global transit |
Standard & purity: ASTM B737; confirm required Hf/Zr ratio & impurity limits.
Diameter & form: 0.1–5.0 mm; coil vs. straight; tolerance and spool/pack format.
Condition: cold drawn or annealed depending on handling and forming needs.
Surface & cleanliness: bright metallic; any additional cleaning/packaging for vacuum or cleanroom use.
Testing & documentation: chemistry, mechanical, dimensional reports; MTC EN 10204 3.1; third-party certificates if needed.
Quantity & packaging: coil lengths, batch sizes, export packing and labeling/traceability.
End use: semiconductor, plasma, superalloy, R&D, etc., to align specs and QA scope.
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