Product Positioning

Specialized for sputtering applications, this tantalum material ensures high – purity and precise impurity control. It meets the strict requirements of industries like electronics and semiconductors for thin – film deposition processes, enabling the production of high – performance tantalum films.

Core Advantages

Technical Specifications(ppm)

Impurities5N Ta4N5 Ta4N Ta3N5 Ta
Fe<1<1<1<5
Ni<1<1<1<5
Cr<1<1<1<5
Cu<1<1<1<5
Nb<10<50<100<500
W<8<25<80<150
Mo<5<25<50<100
Na<0.4<0.4<1<5
Li<0.1<0.1<1<5
K<0.4<0.4<1<5
U<0.001<0.005<0.005<0.005
Th<0.001<0.005<0.005<0.005
Others<0.1<1<5<10
C<30<40<40<50
O<80<80<100<100
N<30<40<40<50
H<5<10<10<10

Application Scenarios

Quality Assurance

Adheres to strict quality control procedures. The impurity content is accurately measured and controlled to meet the high standards of sputtering applications, providing reliable material support for advanced manufacturing processes.

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