Titanium Clad Copper

Premium titanium-clad copper for electrolysis, electroplating and power applications. LuminaTitan supplies plate, sheet and bus-bar clad with Ti (Gr1/Gr2) over high-conductivity copper (C11000/C10200), providing corrosion resistance on the wetted surface with copper’s electrical/thermal conductivity. Manufactured under controlled bonding processes and verified in‑house for bond integrity, conductivity and dimensional stability.

Key Advantages

Ti-side corrosion resistance with Cu-side conductivity—ideal for electrochemical cells and bus bars.
Reliable bond integrity (shear and bend tested) with low interfacial resistance.
Custom Ti thickness and Cu core grades to balance durability and current capacity.
Machinable to drawings; edges sealed and corners chamfered to reduce delamination risk.
Traceable batches with MTC EN 10204 3.1 and optional test reports.

Primary Applications

Electroplating and PCB lines: anode/cathode bus bars, contact heads, racks.
Electrowinning/electrorefining cells (copper, nickel, zinc): corrosion‑resistant current carriers.
Chlor‑alkali and chemical processing equipment: wetted conductive parts.
Power distribution in corrosive environments: terminals and connectors.

Testing (typical)

Ultrasonic testing across plate area; edge dye‑penetrant (Ti side).
Shear / peel strength of Ti‑Cu interface; guided bend checks.
Electrical resistivity / IACS conductivity (Cu core).
Dimensional: thickness (Ti layer & total), flatness, straightness.

Packaging & Delivery

VCI wrap and edge protection → export plywood cases; Ti face protected.
Labels include structure (Ti/Cu), grades, sizes, Ti‑thickness, lot/heat, PO; test docs enclosed.
Global courier or sea freight; lead times aligned with your schedule.

Product Description

Titanium Clad Copper combines a corrosion‑resistant titanium surface with a high‑conductivity copper core. We offer explosive‑bonded or roll‑bonded laminates with Ti Gr1 or Gr2 and copper C11000 (ETP) or C10200 (OF). Clad plates and bus bars are finished on the titanium face (pickled/ground) to perform in acidic/chloride media, while the copper side maintains low electrical losses. Parts can be supplied as cut‑to‑size plates or machined to drawing.

Technical Specifications

Parameter	Details	Why It Works for You
Standard	ASTM B898 (titanium‑clad copper); EN 10204 3.1 docs	Recognized spec and documentation for qualification.
Structure	Titanium layer + Copper core (Ti/Cu laminate)	Corrosion resistance + electrical/thermal conductivity.
Ti Grade	Gr1 or Gr2 (ASTM B265)	Gr1 for maximum corrosion; Gr2 for higher strength.
Cu Grade	C11000 (ETP) or C10200 (OF)	High conductivity; oxygen‑free option for critical bonding.
Bonding Method	Explosive bonding or roll bonding	High bond strength with stable interface.
Dimensions	Total thickness 2–60 mm; Ti layer 0.5–3.0 mm; width ≤ 2000 mm; length ≤ 6000 mm	Sized for bus bars and plates; other sizes on request.
Bond Strength	Shear ≥ 130 MPa (typical, per lot test)	Secure interface for machining and service loads.
Conductivity	≥ 80–95% IACS (by copper grade/geometry)	Low losses for current‑carrying parts.
Surface (Ti/Cu)	Ti: pickled/ground; Cu: bare or tinned/silver‑plated (opt.)	Ready for service or downstream joining.
Forms	Plate/sheet, bus‑bar, cut blanks; parts to drawing	Drop‑in components for your line.
Inspection	UT map, shear/peel, bend; dimensions; conductivity	Verifies bond, integrity and performance.