Precision customization: Cu content 10–50%, broad forms (plate/sheet/bar/rod/wire/disc/ring/foil/fittings); small-batch sampling.
High-temp + conductivity: tungsten’s heat resistance with copper’s electrical/thermal conductivity for demanding duty.
Process control & QA: powder mixing, isostatic pressing, high-temp sintering; chemical/physical/conductivity/metallography tests.
Electrodes & contacts: arc-resistant materials for stable switching.
Electronic packaging: thermal management parts supporting heat dissipation.
Aerospace & defense: special-purpose components operating at high temperature.
Chemical composition test
Physical properties (density, hardness, resistivity)
Conductivity measurement
Appearance & size inspection
Metallography evaluation
Packaging: plastic film + export wooden cases to prevent friction and damage.
Shipping: global courier or sea freight; lead times aligned with your schedule.
LuminaTitanium provides high-performance Tungsten Copper Alloy engineered to ASTM B702. Produced via powder metallurgy, CuW combines tungsten’s high-temperature resistance with copper’s conductivity, making it suitable for electrodes, electronic packaging, and aerospace components. Custom shapes and surface finishes (machined, polished) available.
| Parameter | Details | Value |
|---|---|---|
| Material | Pure tungsten + pure copper | High-temp resistance + excellent conductivity |
| Standard | Conformance | ASTM B702 |
| Technology | Process route | Powder metallurgy (uniform microstructure, high purity) |
| Cu content | Typical range | 10%–50% Cu (W balance) |
| Surface | Finish options | Machined / Polished |
| Forms | Supply shapes | Plate, Sheet, Bar, Rod, Wire, Disc, Ring, Foil, Fittings, Custom |
| Symbol | Cu (%) | Total Impurities ≤ (%) | W (%) | Density ≥ (g/cm³) | Hardness HB ≥ | Resistivity ≤ (nΩ·cm) | Conductivity ≥ (IACS/%) | Bending Strength ≥ (MPa) |
|---|---|---|---|---|---|---|---|---|
| CuW(50) | 50±2.0 | 0.5 | Bal | 11.85 | 115 | 3.2 | 54 | — |
| CuW(45) | 45±2.0 | 0.5 | Bal | 12.30 | 125 | 3.5 | 49 | — |
| CuW(40) | 40±2.0 | 0.5 | Bal | 12.75 | 140 | 3.7 | 47 | — |
| CuW(35) | 35±2.0 | 0.5 | Bal | 13.30 | 155 | 3.9 | 44 | — |
| CuW(30) | 30±2.0 | 0.5 | Bal | 13.80 | 175 | 4.1 | 42 | 790 |
| CuW(25) | 25±2.0 | 0.5 | Bal | 14.50 | 195 | 4.5 | 38 | 885 |
| CuW(20) | 20±2.0 | 0.5 | Bal | 15.15 | 220 | 5.0 | 34 | 980 |
| CuW(15) | 15±2.0 | 0.5 | Bal | 15.90 | 240 | 5.7 | 30 | 1080 |
| CuW(10) | 10±2.0 | 0.5 | Bal | 16.75 | 260 | 6.5 | 27 | 1160 |
Standard & composition: e.g., ASTM B702; CuW(10–50)
Form & dimensions: plate/sheet/bar/rod/wire/disc/ring/foil/fittings; size & tolerance
Surface & finish: machined / polished; any conductivity or roughness targets
Testing & QA: chemical/physical/resistivity; metallography; acceptance criteria
Quantity & packaging: lot size; anti-friction protection; export wooden cases
Logistics & terms: target lead time; Incoterms; destination & carrier
Notes: end-use (switch contacts, electrodes, packaging class) for tailored recommendations
