LuminaTitanium provides high – performance Tungsten Copper Alloy, engineered to ASTM B702 standards. Produced via powder metallurgy, it combines tungsten’s high – temp resistance and copper’s conductivity, suiting electrodes, electronic packaging, and aerospace applications.
Parameter | Details | Why It Works for You |
Material | Pure tungsten, Pure copper | Delivers high – temp resistance and excellent conductivity. |
Standard | ASTM B702 | Aligns with global industrial quality—ensures reliability in critical applications. |
Technology | Powder Metallurgy | Enables uniform microstructure, high purity, and complex shapes. |
Surface | Machining, Polishing | Suits aesthetic and functional needs (smoothness, conductivity). |
Shape | Plate, Sheet, Bar, Rod, Wire, Disc, Ring, Foil, Fittings, Customization | Adapts to diverse industrial needs (electrodes, aerospace components). |
Symbol | Cu (%) | Total Impurities (≤%) | W (%) | Density (g/cm³ ≥) | Hardness HB (≥) | Resistivity (nΩ·cm ≤) | Conductivity IACS/% (≥) | Bending Strength MPa (≥) |
CuW(50) | 50±2.0 | 0.5 | Bal | 11.85 | 115 | 3.2 | 54 | — |
CuW(45) | 45±2.0 | 0.5 | Bal | 12.3 | 125 | 3.5 | 49 | — |
CuW(40) | 40±2.0 | 0.5 | Bal | 12.75 | 140 | 3.7 | 47 | — |
CuW(35) | 35±2.0 | 0.5 | Bal | 13.30 | 155 | 3.9 | 44 | — |
CuW(30) | 30±2.0 | 0.5 | Bal | 13.80 | 175 | 4.1 | 42 | 790 |
CuW(25) | 25±2.0 | 0.5 | Bal | 14.50 | 195 | 4.5 | 38 | 885 |
CuW(20) | 20±2.0 | 0.5 | Bal | 15.15 | 220 | 5.0 | 34 | 980 |
CuW(15) | 15±2.0 | 0.5 | Bal | 15.90 | 240 | 5.7 | 30 | 1080 |
CuW(10) | 10±2.0 | 0.5 | Bal | 16.75 | 260 | 6.5 | 27 | 1160 |