Precision customization: Cu content 10–50%, broad forms (plate/sheet/bar/rod/wire/disc/ring/foil/fittings); small-batch sampling.
High-temp + conductivity: tungsten’s heat resistance with copper’s electrical/thermal conductivity for demanding duty.
Process control & QA: powder mixing, isostatic pressing, high-temp sintering; chemical/physical/conductivity/metallography tests.
Electrodes & contacts: arc-resistant materials for stable switching.
Electronic packaging: thermal management parts supporting heat dissipation.
Aerospace & defense: special-purpose components operating at high temperature.
Chemical composition test
Physical properties (density, hardness, resistivity)
Conductivity measurement
Appearance & size inspection
Metallography evaluation
Send your specifications (grade, size, quantity) — quotation and lead time within 12 hours. Trial orders with flexible MOQ are supported for evaluation and qualification. All materials are supplied with EN 10204 3.1 MTC and full inspection documentation for export compliance.
LuminaTitanium provides high-performance Tungsten Copper Alloy engineered to ASTM B702. Produced via powder metallurgy, CuW combines tungsten’s high-temperature resistance with copper’s conductivity, making it suitable for electrodes, electronic packaging, and aerospace components. Custom shapes and surface finishes (machined, polished) available.
| Parameter | Details | Value |
|---|---|---|
| Material | Pure tungsten + pure copper | High-temp resistance + excellent conductivity |
| Standard | Conformance | ASTM B702 |
| Technology | Process route | Powder metallurgy (uniform microstructure, high purity) |
| Cu content | Typical range | 10%–50% Cu (W balance) |
| Surface | Finish options | Machined / Polished |
| Forms | Supply shapes | Plate, Sheet, Bar, Rod, Wire, Disc, Ring, Foil, Fittings, Custom |
| Symbol | Cu (%) | Total Impurities ≤ (%) | W (%) | Density ≥ (g/cm³) | Hardness HB ≥ | Resistivity ≤ (nΩ·cm) | Conductivity ≥ (IACS/%) | Bending Strength ≥ (MPa) |
|---|---|---|---|---|---|---|---|---|
| CuW(50) | 50±2.0 | 0.5 | Bal | 11.85 | 115 | 3.2 | 54 | — |
| CuW(45) | 45±2.0 | 0.5 | Bal | 12.30 | 125 | 3.5 | 49 | — |
| CuW(40) | 40±2.0 | 0.5 | Bal | 12.75 | 140 | 3.7 | 47 | — |
| CuW(35) | 35±2.0 | 0.5 | Bal | 13.30 | 155 | 3.9 | 44 | — |
| CuW(30) | 30±2.0 | 0.5 | Bal | 13.80 | 175 | 4.1 | 42 | 790 |
| CuW(25) | 25±2.0 | 0.5 | Bal | 14.50 | 195 | 4.5 | 38 | 885 |
| CuW(20) | 20±2.0 | 0.5 | Bal | 15.15 | 220 | 5.0 | 34 | 980 |
| CuW(15) | 15±2.0 | 0.5 | Bal | 15.90 | 240 | 5.7 | 30 | 1080 |
| CuW(10) | 10±2.0 | 0.5 | Bal | 16.75 | 260 | 6.5 | 27 | 1160 |
Standard & composition: e.g., ASTM B702; CuW(10–50)
Form & dimensions: plate/sheet/bar/rod/wire/disc/ring/foil/fittings; size & tolerance
Surface & finish: machined / polished; any conductivity or roughness targets
Testing & QA: chemical/physical/resistivity; metallography; acceptance criteria
Quantity & packaging: lot size; anti-friction protection; export wooden cases
Logistics & terms: target lead time; Incoterms; destination & carrier
Notes: end-use (switch contacts, electrodes, packaging class) for tailored recommendations
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